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Solder paste

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Lead-free

 
Itern Specification
Lead-free Sn/Cu0.7
SAC0307
SAC305
Low temperature
Any alloy available
 
Code
 
Alloy
 
melting temperature(℃) Product characteristics
 
Solidus Liquidus
HG-F102 SnCu0.7 227 227 Lead free solder paste,High melting point,Stability, printability, good wettability
HG-F301 SnAg3Cu0.5 217 218 Silver content lead free solder paste,High melting point,Stability, printability, good wettability
HG-F303 SnAg0.3Cu0.7 217 223 Low silver content lead free solder paste,High melting point,Stability, printability, wettability
HG-F501 Sn42Bi58 139 139 Low temperature lead free solder paste,Stability, printability, wettability

All specification can be customized
 

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